AGM 6K FPGA，针对高容量且成本敏感的系统设计应用

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AG6K FPGA器件面向大批量，对成本敏感的应用，使系统设计人员能够满足不断增长的性能要求，同时降低成本。

特征

• 具有6K LE的高密度架构
• M9K嵌入式内存块，最大414Kbit的RAM空间
• 最多可将23个18 x 18位嵌入式乘法器配置为两个独立的9 x 9位乘法器
• 每个器件提供2个PLL，提供时钟乘法和相移
• 高速差分I / O标准支持，包括LVDS，RSDS，mini-LVDS，LVPECL
• 单端I / O标准支持，包括3.3V，2.5V，1.8V和1.5V LVCMOS和LVTTL
• 通用封装选项LQFP-144，-176和FBGA-256
• 通过JTAG和SPI接口进行灵活的设备配置
• 支持远程更新，通过“双重启动”之类的实现
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AG6K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs.

Features

• High-density architecture with 6K LEs
• M9K embedded memory blocks, up to 414Kbits of RAM space
• Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
• Provides 2 PLLs per device provide clock multiplication and phase shifting
• High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
• Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
• General package options, LQFP-144, -176 and FBGA-256
• Flexible device configuration through JTAG and SPI interface
• Support remote update, by "dual-boot" like implementation