AGM AG16K FPGA，面向大容量低成本的的系统应用

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国产FPGA芯片公司AGM的器件，AG16K FPGA器件面向大批量，成本敏感型应用，使系统设计人员能够满足不断增长的性能要求，同时降低成本。 设备AG16K 提供了卓越的质量，稳定性和出众的价格。

特征

• 具有16K LE的高密度架构
• 高达504Kbit的RAM空间
• 最多可将56个18 x 18位嵌入式乘法器配置为两个独立的9 x 9位乘法器
• 每个器件提供4个PLL，提供时钟乘法和相移
• 高速差分I / O标准支持，包括LVDS，RSDS，mini-LVDS，LVPECL
• SSTL，SSTL-II IO标准，支持DDR，DDR2
• 单端I / O标准支持，包括3.3V，2.5V，1.8V和1.5V LVCMOS和LVTTL
• 通用封装选项LQFP-144，-176和FBGA-256
• 两个12位SarADC（嵌入式温度传感器）
• 通过JTAG和SPI接口进行灵活的设备配置
• 支持远程更新，通过“双重启动”之类的实现
• 支持片上信号调试
  

AG16K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG16K offers supreme quality, stability, and exceptional pricing value.

Features

• High-density architecture with 16K LEs
• Up to 504Kbits of RAM space
• Up to 56 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
• Provides 4 PLLs per device provide clock multiplication and phase shifting
• High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
• SSTL, SSTL-II IO standard, support DDR, DDR2
• Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
• General package options, LQFP-144, -176 and FBGA-256
• Two 12-bits SarADC (embedded temp sensor)
• Flexible device configuration through JTAG and SPI interface
• Support remote update, by "dual-boot" like implementation
• Support on chip signal debugging
  

Download Datasheet

AG16KSDE176/AG16KSDF256/AG16KSDE176G devices are AG16K FPGA bonded with 64MBit 32-bit 166MHz SDRAM :

- AG16KSDE176, QFP-176 papckage suppports 2-layer PCB(cost-down) design. AG16KSDE176 is pin-to-pin compatible with AG10KSDE176.

- AG16KSDF256,  FBGA-256 package supports 152 user IOs and 3 additional ADC IO.

- AG16KSDE176G, QFP-176 package suppports 2-layer PCB(cost-down) design, with 139 user IOs.

AG16KDDF256 device is AG16K FPGA bonded with 128MBits 16-bit 200MHz DDR-SDRAM, FBGA-256 package supports 170 user IOs.